BYK-A 530
BYK-A 530
Silicone and polymer-containing defoamer/air release additive for solvent-borne and solvent-free coatings, for plastic systems (ambient-curing and pultrusion applications), adhesives and sealants.
Particularly recommended for epoxy resin systems.
Fiche technique : TDS_BYK-A_530_EN
Silicone and polymer-containing defoamer/air release additive for solvent-borne and solvent-free coatings, for plastic systems (ambient-curing and pultrusion applications), adhesives and sealants.
Particularly recommended for epoxy resin systems.